Pattern resistance, heat generation, inductance, parasitic capacitance

This is a calculator for pattern resistance, pattern heat generation, pattern inductance and parasitic capacitance. Resistance and inductance (inductance) components are also generated in the copper foil pattern of the board. Patterns with large currents and high-speed signals where inductance is a concern should be treated with caution. Guidelines for copper foil thickness: 35um on the surface layer of a rigid board, 12um on the surface layer of a flexible board .

Diagram: Pattern resistance, heat generation, inductance, parasitic capacitance
mm
mm
mm
A

SI prefixes accepted (4k7 / 1M / 10m / 220). Upper-case M = mega, lower-case m = milli

Pattern resistance
33.142857m ohm
Pattern inductance10.3745 nH
Pattern consumption33.142857 mW
Parasitic Capacitance0.571 pF
Advanced — Dielectric thickness, Pcb relative permittivity
mm
er

Derived values

Voltage drop
33.143 mV
Current × trace resistance
History
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